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제목 [국제학술대회] SMILE 2019 & ISMI 2019 개최 안내
작성자 KIIE 등록일 2018-12-27
이메일 admin@kiie.org
2019 IEEE International Conference on Smart Manufacturing, Industrial & Logistics Engineering (SMILE2019) &
2019 International Symposium on Semiconductor Manufacturing Intelligence (ISMI2019)
April 19-21, 2019, Zhejiang University, Hangzhou, China
The accepted full papers will indexed by EI Compendex.
Selected papers will be recommended for reviews and possible publications in special issues of SCI journals.
Keynote Speakers
Professor Andrew Kusiak, the University of Iowa, USA, Editor-in-chief of Journal of Intelligent Manufacturing
Professor Tae-Eog Lee, Korea Advanced Institute of Science and Technology (KAIST), South Korea,
President of Korea Institute of Industrial Engineers (KIIE)
Professor Hing Kai Chan, Ningbo Nottingham University, China, Co-editor of Industrial Management & Data Systems
Professor Lihui Wang, KTH Royal Institute of Technology, Stockholm, Sweden,
Editor-in-Chief of Robotic and Computer-Integrated Manufacturing
All papers must be written in English with a maximum length of 5 pages. For paper format, submission, and related information, please visit:
http://smile.ieeng.org/ and submission page: https://easychair.org/conferences/?conf=smile2019. For the accepted papers, please download Copyright in conference website by yourself, and send back to email: smile_ismi2019@163.com. The Full papers are reviewed for presentation at the conference as well as for publication in the conference proceedings which is indexed by EI. Extended version of some selected papers will be published in the SCI journals. Candidates are: Computers & Industrial Engineering, Journal of Intelligent Manufacturing, and International Journal of Industrial Engineering: TAP and so on.
Important Dates:
Deadline for submission of abstract/ special session proposals: December 1, 2018
Deadline for Full Paper Submission for EI indexed proceedings for IEEE Xplore: December 31, 2018 -> January 20, 2019
Deadline for Full Paper/Extended Abstract Submission: January 31, 2019
Camera Ready Manuscript Submission: February 28, 2019